Zur Person
02/2018 Promotion; Thema "Deep-Sea Model-Aided Navigation Accuracy for Autonomous Underwater Vehicles Using Online Calibrated Dynamic Models"
Seit 07/2013
Wissenschaftlicher Mitarbeiter am Institut für Prozessrechentechnik, Automation und Robotik.
10/2011 – 03/2012
Diplomarbeit an der Carnegie Mellon University in Pittsburgh, USA. Thema: „Energy Network enhancement and stability“.
10/2008 – 06/2013
Studium der (angewandten) Mathematik am KIT. Schwerpunkte u.a.: Numerik für DGL, FEM.
10/2007 – 11/2012
Studium der Informatik am KIT. Schwerpunkte: Automation & Robotik, Kognitive Systeme (Sichtprüfung und Bildverarbeitung).
| Titel | Förderung | Starttermin | Endtermin | Ansprechpartner |
|---|---|---|---|---|
| SMIS - Subsea Monitoring via Intelligent Swarms | 01.01.2013 |
31.10.2016 |
Publikationen
Deep Net Localization - Eavesdropping in mobile acoustic underwater sensor networks
Neumann, S.; Oertel, D.; Wörn, H.
2017. Techno-Ocean 2016: Return to the Oceans. 16th Techno-Ocean, Techno-Ocean 2016; Kobe Convention CenterKobe; Japan; 6 October 2016 through 8 October 2016., 205–210, Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/Techno-Ocean.2016.7890647
Neumann, S.; Oertel, D.; Wörn, H.
2017. Techno-Ocean 2016: Return to the Oceans. 16th Techno-Ocean, Techno-Ocean 2016; Kobe Convention CenterKobe; Japan; 6 October 2016 through 8 October 2016., 205–210, Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/Techno-Ocean.2016.7890647
Self-localization by eavesdropping in acoustic underwater sensor networks
Neumann, S.; Oertel, D.; Woern, H.
2017. 2016 IEEE International Conference on Multisensor Fusion and Integration for Intelligent Systems (MFI), Baden-Baden, September 19-21, 2016, 328–334, Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/MFI.2016.7849509
Neumann, S.; Oertel, D.; Woern, H.
2017. 2016 IEEE International Conference on Multisensor Fusion and Integration for Intelligent Systems (MFI), Baden-Baden, September 19-21, 2016, 328–334, Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/MFI.2016.7849509
Reducing elevation angle errors of long-range deep-sea acoustic localization by ray tracing and depth measurements
Oertel, D.; Neumann, S.; Worn, H.; Golz, M.; Waniek, J. J.
2016. IEEE International Conference on Advanced Intelligent Mechatronics (AIM), Banff, Canada, 12-15 July 2016, 178–183, Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/AIM.2016.7576763
Oertel, D.; Neumann, S.; Worn, H.; Golz, M.; Waniek, J. J.
2016. IEEE International Conference on Advanced Intelligent Mechatronics (AIM), Banff, Canada, 12-15 July 2016, 178–183, Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/AIM.2016.7576763
Failure recovery for modular robot movements without reassembling modules
Vonásek, V.; Oertel, D.; Neumann, S.; Wörn, H.
2015. 10th International Workshop on Robot Motion and Control, RoMoCo 2015, Poznan, P, 136–141, Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/RoMoCo.2015.7219725
Vonásek, V.; Oertel, D.; Neumann, S.; Wörn, H.
2015. 10th International Workshop on Robot Motion and Control, RoMoCo 2015, Poznan, P, 136–141, Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/RoMoCo.2015.7219725
Towards deep-sea monitoring with SMIS - Experimental trials of deep-sea acoustic localization
Neumann, S.; Oertel, D.; Wörn, H.
2015. ASSISTIVE ROBOTICS: Proceedings of the 18th International Conference on CLAWAR 2015 : 18th International Conference on Climbing and Walking Robots and the Support Technologies for Mobile Machines, 6 – 9 September 2015, HangZhou, China. Ed.: H. Su, 715–725, World Scientific Publishing
Neumann, S.; Oertel, D.; Wörn, H.
2015. ASSISTIVE ROBOTICS: Proceedings of the 18th International Conference on CLAWAR 2015 : 18th International Conference on Climbing and Walking Robots and the Support Technologies for Mobile Machines, 6 – 9 September 2015, HangZhou, China. Ed.: H. Su, 715–725, World Scientific Publishing
Online motion planning for failure recovery of modular robotic systems
Vonasek, V.; Neumann, S.; Oertel, D.; Wörn, H.
2015. 2015 IEEE International Conference on Robotics and Automation, ICRA 2015; 26 May 2015 through 30 May 2015, Seattle, United States, 1905–1910, Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/ICRA.2015.7139447
Vonasek, V.; Neumann, S.; Oertel, D.; Wörn, H.
2015. 2015 IEEE International Conference on Robotics and Automation, ICRA 2015; 26 May 2015 through 30 May 2015, Seattle, United States, 1905–1910, Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/ICRA.2015.7139447
Knowledge-based direction prediction to optimize the null-space parameter of a redundant robot in a telemanipulation scenario
Hutzl, J.; Oertel, D.; Wörn, H.
2014. 12th IEEE International Symposium on Robotic and Sensors Environments, ROSE 2014, Timisoara, RUM, October 16-18, 2014, 25–30, Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/ROSE.2014.6952978
Hutzl, J.; Oertel, D.; Wörn, H.
2014. 12th IEEE International Symposium on Robotic and Sensors Environments, ROSE 2014, Timisoara, RUM, October 16-18, 2014, 25–30, Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/ROSE.2014.6952978
Complexity of transmission network expansion planning NP-hardness of connected networks and MINLP evaluation
Oertel, D.; Ravi, R.
2014. Energy systems, 5 (1), 179–207. doi:10.1007/s12667-013-0091-3
Oertel, D.; Ravi, R.
2014. Energy systems, 5 (1), 179–207. doi:10.1007/s12667-013-0091-3
Tactile sensor on a magnetic basis using novel 3D Hall sensor - First prototypes and results
Ledermann, C.; Wirges, S.; Oertel, D.; Mende, M.; Woern, H.
2013. IEEE 17th International Conference on Intelligent Engineering Systems (INES’13), San Jose, California/USA, June 19-21, 2013, 55–60, Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/INES.2013.6632782
Ledermann, C.; Wirges, S.; Oertel, D.; Mende, M.; Woern, H.
2013. IEEE 17th International Conference on Intelligent Engineering Systems (INES’13), San Jose, California/USA, June 19-21, 2013, 55–60, Institute of Electrical and Electronics Engineers (IEEE). doi:10.1109/INES.2013.6632782